PACKAGE STRIP AND ITS ARRAY

摘要

A package strip and a panel array are provided to arrange a large amount of package strips on the panel array by using a predetermined portion of a dummy region of the package strip as a dummy portion of the panel array. A semiconductor element is mounted on a semiconductor package substrate which includes a package region and a strip dummy region. An external circuit pattern is formed on the package region. The strip dummy region is formed to enclose the package region. A package strip(100) of the semiconductor package substrate is arranged on a panel array(200), on which panel dummies are formed. A predetermined region of the strip dummy region of the package strip is used as the panel dummy of the panel array, such that the package strip is arranged on the panel array. The strip dummy region of the package strip is formed to be matched with the panel dummy region of the panel array.