| 摘要 |
The lead frame (10) has drain leads (7) with first ends proximate one edge of the die pad and second ends distal from the die pad. A gate lead is proximate an opposite edge of the die pad and extends away from it. Source leads (6) are integral with the die pad and extend away from the same edge as the gate lead. After encapsulation the universal drain clip (30) is attached to the drain of the die and selectively attached to the distal ends of the drain leads. For landed grid footprints and ball grid footprints, the universal clip provides a drain contact on the same exterior surface as the source and gate contacts. For an MLP footprint, the universal drain is connected to the distal ends of the drain leads to carry the drain contact to the opposite external surface. |
