DIE ADHESIVE PASTE COMPOSITION

摘要

A paste composition for the adhesion of a die is provided to improve thixotropic index, thereby preventing the generation of dog-ear or residue in case of pasting printing process. A paste composition for the adhesion of a die comprises 100 parts by weight of a solid or liquid epoxy resin; 15-30 parts by weight of the rubber having a molecular weight of 50,000 or more; 10-30 parts by weight of a rubber modifier; 5-10 parts by weight of an acrylate; 5-8 parts by weight of an inorganic filler; 2-5 parts by weight of a thermal curing agent; and 1-5 parts by weight of a curing agent, wherein the inorganic filler is a hydrophobic silica having a particle size of 10-20 nm and a BET surface area of 100±50 m^2/g.