发明名称 |
ADHESION METHOD OF THERMAL-CONDUCTIVE SILICONE COMPOSITION, PRIMER FOR ADHESION OF THERMAL-CONDUCTIVE SILICONE COMPOSITION AND PROCESS FOR PRODUCING ADHESIVE COMPOSITE OF THERMAL-CONDUCTIVE SILICONE COMPOSITION |
摘要 |
An adhesion method for a thermally conductive silicone composition is provided to realize excellent adhesion of a thermally conductive silicone composition to the surface of a noble metal such as gold or silver. An adhesion method for a thermally conductive silicone composition comprises the steps of: applying a primer comprising a platinum group compound and a solvent and free from an alkoxysilane onto the surface of a metal or alloy comprising at least one selected from gold, silver and platinum group(Group 8) elements, followed by drying; and adhering a thermally conductive silicone composition to the resultant surface.
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申请公布号 |
KR20080038048(A) |
申请公布日期 |
2008.05.02 |
申请号 |
KR20070108079 |
申请日期 |
2007.10.26 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
YAMADA KUNIHIRO;ENDO AKIHIRO;MIYOSHI KEI |
分类号 |
C09J1/00;C09J183/00;C09J183/04 |
主分类号 |
C09J1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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