发明名称 ADHESION METHOD OF THERMAL-CONDUCTIVE SILICONE COMPOSITION, PRIMER FOR ADHESION OF THERMAL-CONDUCTIVE SILICONE COMPOSITION AND PROCESS FOR PRODUCING ADHESIVE COMPOSITE OF THERMAL-CONDUCTIVE SILICONE COMPOSITION
摘要 An adhesion method for a thermally conductive silicone composition is provided to realize excellent adhesion of a thermally conductive silicone composition to the surface of a noble metal such as gold or silver. An adhesion method for a thermally conductive silicone composition comprises the steps of: applying a primer comprising a platinum group compound and a solvent and free from an alkoxysilane onto the surface of a metal or alloy comprising at least one selected from gold, silver and platinum group(Group 8) elements, followed by drying; and adhering a thermally conductive silicone composition to the resultant surface.
申请公布号 KR20080038048(A) 申请公布日期 2008.05.02
申请号 KR20070108079 申请日期 2007.10.26
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 YAMADA KUNIHIRO;ENDO AKIHIRO;MIYOSHI KEI
分类号 C09J1/00;C09J183/00;C09J183/04 主分类号 C09J1/00
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