A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linearly enabling placement of the test structure in a saw street between dies.
申请公布号
WO2007145729(A3)
申请公布日期
2008.05.02
申请号
WO2007US10802
申请日期
2007.05.03
申请人
CASCADE MICROTECH, INC.;STRID, ERIC;CAMPBELL, RICHARD