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发明名称
双面研磨装置用载具、使用此载具之双面研磨装置及双面研磨方法
摘要
本发明是关于一种双面研磨装置用载具,是于双面研磨装置中,配设于贴付有研磨布之上下方转盘之间,为了保持研磨时包挟于该上下方转盘之间的半导体晶圆而形成保持孔之型态的双面研磨装置用载具,该载具的材质系钛,该钛制载具的表面粗糙度Ra为0.14m以上。藉此,可提供一种双面研磨装置用载具、使用此载具之双面研磨装置及双面研磨方法,于半导体晶圆的双面研磨时,可安定、有效率、低成本地生产出可减少晶圆外周塌,具有高平坦度之高品质的晶圆。
申请公布号
TW200819242
申请公布日期
2008.05.01
申请号
TW096122804
申请日期
2007.06.23
申请人
信越半导体股份有限公司
发明人
内山勇雄
分类号
B24B37/02(2006.01);B24B41/06(2006.01);H01L21/304(2006.01)
主分类号
B24B37/02(2006.01)
代理机构
代理人
蔡坤财;李世章
主权项
地址
日本
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