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发明名称
基板及封装结构之制造方法
摘要
一种基板及封装结构之制造方法。基板包括一第一表面、一置晶区、一切割路径、数个第一接垫及一第一防焊层。置晶区系位于第一表面上,用以设置一晶片。第一接垫系设置于第一表面上。第一防焊层系设置于部分之第一表面之上,并暴露部分切割路径及些第一接垫。第一防焊层系藉由切割路径大致分离为一第一内部区及一第一外部区。置晶区及第一接垫系位于第一内部区内。其中,切割路径上至少有部分连通第一内部区与第二外部区之第一防焊层。
申请公布号
TW200820405
申请公布日期
2008.05.01
申请号
TW095138268
申请日期
2006.10.17
申请人
日月光半导体制造股份有限公司
发明人
张云龙;孙铭伟
分类号
H01L23/48(2006.01);H01L23/28(2006.01);H01L21/60(2006.01)
主分类号
H01L23/48(2006.01)
代理机构
代理人
林素华
主权项
地址
高雄市楠梓加工区经三路26号
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