| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and mounting method in which the mounting direction of an electronic component can be changed easily for the substrate and accurate mounting with no displacement can be carried out without requiring a mechanism for rotating the substrate while utilizing the advantage of punching die mounting where positioning of an electronic component at a pickup position is easy. <P>SOLUTION: A nozzle 48 picking up an electronic component P is raised and the electronic component P is separated from the abutting surface, and the mounting direction of the electronic component P is adjusted for the substrate by rotating the nozzle 48 before the electronic component P is mounted. Relation between rotation angle of the nozzle 48 and displacement of the electronic component P from a target mounting position in the mounting direction is determined previously and its data are stored. When the electronic component P is mounted, relative position of the nozzle 48 to the substrate is corrected to cancel the displacement, and lowered thus mounting the electronic component. <P>COPYRIGHT: (C)2008,JPO&INPIT |
