发明名称 Method and System For Making Photo-Resist Patterns
摘要 A method of forming a resist pattern in a semiconductor device layer includes forming a buffer layer on a semiconductor device layer and forming a resist layer on the buffer layer. A decomposing agent is released into a portion of the buffer layer by a portion of the resist layer whereupon the portion of the buffer layer and the portion of the resist layer are removed to form a process window substantially free of resist residue that can be subsequently exploited for etching of the semiconductor device layer.
申请公布号 US2008102648(A1) 申请公布日期 2008.05.01
申请号 US20060555558 申请日期 2006.11.01
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN CHIN-HSIANG;LU HSIAO-TZU;CHEN KUEI SHUN;CHANG CHING-YU;CHANG VENCENT
分类号 H01L21/302;G03G13/10 主分类号 H01L21/302
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