METHOD FOR SIMULTANEOUSLY SLICING AT LEAST TWO CYLINDRICAL WORKPIECES INTO A MULTIPLICITY OF WAFERS

摘要

Slicing multiple cylindrical workpieces into wafers by a multi wire saw with a gang length L_G, is performed by: a) selecting a number n>=2 of workpieces from a stock of workpieces with different lengths, satisfying the inequality $\begin{array}{cc}{L}_G>=\left(n-1\right).A_{\min }+\sum _{i=1}^nL_1& \left(1\right)\end{array}$ and making right-hand side of the inequality as large as possible, where L_i with i=1 . . . n are for the lengths of the workpieces and A_min is a predefined minimum spacing, b) fixing the n workpieces successively in the longitudinal direction on a mounting plate while maintaining a spacing A>=A_min therebetween such that the relationship $\begin{array}{cc}{L}_G>=\left(n-1\right).A+\sum _{i=1}^nL_i& \left(2\right)\end{array}$ is satisfied, c) clamping mounting plates workpieces in a multi wire saw, and d) slicing the n workpieces perpendicularly to their longitudinal axis by means of the multi wire saw. Preferably, the wafer stacks are separated from one another by separating pieces after slicing, and at the same time are laterally supported.