| 摘要 |
A method for producing a wired circuit board includes the steps of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, and forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer. An oxidation-reduction potential of the polymeric liquid of the conductive polymer is lower than a standard electrode potential of a conductive material forming the conductive pattern.
|
