发明名称 COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To accurately press mount a component on a substrate and to simplify a mounting head structure for downsizing and weight reduction. <P>SOLUTION: The mounting head of a component mounting device movable in a planar direction comprises an absorption nozzle 19 for absorption holding the component; a press driving means 8 for moving the press driving unit 8a forward and backward in a Z-axis direction and moving the absorption nozzle supported by the press driving unit in the same direction; a supporting frame 15 for fixing and supporting the press driving means; a Z-axis driving means 11 for moving the supporting frame forward and back in the Z-axis direction and moving the absorption nozzle integrally with the press driving means in the same direction; and a substrate mounting table 30 for supporting the substrate 34 for press mounting the component 40 held by the absorption nozzle by the press mounting means. In this instance, a load detecting means 31 for detecting the load applied to the supporting substrate 34 is attached to the substrate mounting table 30. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008103549(A) 申请公布日期 2008.05.01
申请号 JP20060285153 申请日期 2006.10.19
申请人 JUKI CORP 发明人 SAITO MASARU
分类号 H05K13/04;H01L21/52 主分类号 H05K13/04
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