| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing semiconductor device and a method for manufacturing semiconductor device, which can perform cutting of a semiconductor device assembly with stability, by applying pressure to the semiconductor device assembly that is to be an object of cutting, when the semiconductor device assembly, such as a sealed substrate 10, is cut for semiconductor devices to be produced. <P>SOLUTION: A plurality of semiconductor devices are produced together as the semiconductor device assembly 10. In the apparatus for manufacturing semiconductor device, a cutting jig 48 cuts the semiconductor device assembly into respective semiconductor devices with a holding jig 19 that applies negative pressure to the semiconductor device assembly from one surface side and holding the semiconductor device assembly. The apparatus for manufacturing semiconductor device comprises a sealed chamber 53 containing the holding jig 19, the cutting jig 48, and the semiconductor device assembly 10 as an object to be cut; a gas supply means 37 supplying a high pressure gas into the sealed chamber 53; and a control means for controlling the gas pressure in the sealed chamber 53 at a higher pressure than the atmospheric pressure, where a force that presses the semiconductor device assembly 10 to the holding jig 19 is increased by keeping the high pressure in the inside of the sealed chamber 53. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
