发明名称 |
Semiconductor package and method of forming wire loop of semiconductor package |
摘要 |
Provided are a semiconductor package and a method of forming a wire loop of the semiconductor package. The semiconductor package includes: at least one semiconductor chip; a lead frame including a plurality of leads; and a plurality of wire loops, the wire loops connecting an electrode pad of the semiconductor chip to the leads. Wire loops include: a ball connected to the electrode pad; a pressed part formed on an upper surface of the ball by pressing the wire to overlap two parts of the wire; a first wire part extending substantially horizontally from the pressed part and including at least a portion contacting an upper surface of the semiconductor chip; a second wire part extending at a downward incline from the first wire part; and a third wire part extending from the second wire part and including an end connected to one of the leads.
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申请公布号 |
US2008099895(A1) |
申请公布日期 |
2008.05.01 |
申请号 |
US20070825713 |
申请日期 |
2007.07.09 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
KWAK BYUNG-KIL |
分类号 |
H01L23/495;H01L21/44 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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