STACK STRUCTURE OF POWER MODULE

摘要

PROBLEM TO BE SOLVED: To improve cooling performance without increasing load imposed on a semiconductor chip. SOLUTION: In the stack structure 10 of a power module, a pair of power modules 15a, 15b opposing each other in a stack direction S are coupled via a heat sink 16 erected in a non-contact status with a circuit layer 12 on the surface of a ceramic plate 11 in the one power module 15a so that the surfaces of semiconductor chips 14 may oppose each other with a space in the stack direction S or the surface of the semiconductor chip 14 in the one power module 15a and the rear surface of a cooler 13 in the other power module 15b may oppose each other with a space in the stack direction S. COPYRIGHT: (C)2008,JPO&INPIT