MULTILAYER PRINTED WIRING BOARD, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a highly productive multilayer printed wiring board capable of manufacturing the multilayer printed wiring board excellent in a connection reliability with a simple step. SOLUTION: The method for manufacturing the multilayer printed wiring board comprises the steps of preparing a double-sided board having a base material, a first conductive layer provided on the surface of one side of the base material, and a second conductive layer provided on the surface of the other side of the base material; forming the printed wiring by selectively removing the first conductive layer and the second conductive layer; forming a blind via hole with its bottom face formed by the second conductive layer, and with its wall surface formed by the base material and the first conductive layer by selectively removing the base material; and continuously applying a conductive paste to the surface of the first conductive layer as a periphery of the blind via hole, and to the bottom face of the blind via hole. The first conductive layer and the second conductive layer are electrically connected. COPYRIGHT: (C)2008,JPO&INPIT