发明名称 FLUX COMPOSITION FOR SOLDERING, AND SOLDER PASTE
摘要 PROBLEM TO BE SOLVED: To provide a flux composition for soldering and a solder paste, which are excellent in soldering wettability, suppress the generation of voids in a soldered part, and are excellent in joint reliability and electric reliability. SOLUTION: The flux composition for soldering contains A: a resin that is obtained by bringing a polyhydric alcohol (a1) and a cyclic acid anhydride (a2) having a six-membered carbocyclic ring structure into a ring-opening half esterification reaction, and B: a silicon compound expressed by the formula (1). In the formula (1), r is 2 or 3, and X is a radical group, which is selected from a hydrogen atom, a bromine atom, a chlorine atom, and hydroxy groups and may be identical to or different from each other. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008100262(A) 申请公布日期 2008.05.01
申请号 JP20060285304 申请日期 2006.10.19
申请人 NOF CORP 发明人 SAITO TAKASHI;NISHIMURA NAOYA
分类号 B23K35/363;B23K35/26;C22C13/00;H05K3/34 主分类号 B23K35/363
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