发明名称 POLISHING HEAD AND POLISHING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a rubber chuck type polishing head, etc. which can apply a uniform polishing load to the whole of a workpiece without being affected by the stiffness and the flatness of a core plate. <P>SOLUTION: The polishing head is at least composed of a nearly disk shape core plate, and a rubber film covering at least the lower surface portion and the side surface portion of the core plate, and has a space surrounded with the core plate and the rubber film, and is configured so as to change the pressure in the space by means of a pressure adjusting mechanism, and holds the back side surface of a workpiece on the lower surface portion of the rubber film, and polishes the front side surface of the workpiece by bringing the front side surface of the workpiece into sliding contact with a polishing cloth stuck on a surface plate, wherein the core plate and the rubber film do not completely contact on the whole of at least the lower surface portion of the core plate so as to have some clearance between them. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008100295(A) 申请公布日期 2008.05.01
申请号 JP20060282833 申请日期 2006.10.17
申请人 SHIN ETSU HANDOTAI CO LTD;FUJIKOSHI MACH CORP 发明人 MASUMURA HISASHI;KITAGAWA KOJI;MORITA KOJI;KISHIDA NORIZANE;ARAKAWA SATORU
分类号 B24B37/005;B24B37/04;B24B37/30;H01L21/304 主分类号 B24B37/005
代理机构 代理人
主权项
地址