| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor mounting substrate wherein the connection of soldered bumps is not easily disconnected by an impact or stress to be applied during processes until resin is filled. SOLUTION: A substrate 31 is provided with a coupling bridge 35 at the external circumference of a coupling material, an adhering step is formed at least before a reflow step 25, and a reinforcing frame is adhered to the coupling bridge 35 using a bonding agent 54 in this adhering step. The coupling bridge 35 and the reinforcing frame are cut away in a cutting step 55 after a gap between a semiconductor element 4 and the substrate 31 is filled with resin 7 in a resin injecting step 26. Accordingly, since the reinforcing frame is adhered in the resin injecting step 26, deformation can be reduced withstanding an impact and stress to be applied to the substrate 31. COPYRIGHT: (C)2008,JPO&INPIT
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