发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technique capable of reducing generation of foreign matters in a process of conveying semiconductor wafers, using hand. SOLUTION: A rod 17 is fixed on a piston 16, a first pressure line 19 connected to a first space 18 and a second pressure line 21 connected to a second space 20 are provided to a cylinder 15, and a screw hole 22 and a screw 23 mated with the screw hole 22 are provided on the piston 16. The first space 18 is evacuated from the first pressure line 19 with the second pressure line 21 closed, thereby moving the piston 16 to allow a movable portion 13 to move, and air is taken from the second pressure line 21 into the second space 20 with the first pressure line 19 closed, thereby moving the piston 16 to allow the movable portion 13 to move. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008103379(A) 申请公布日期 2008.05.01
申请号 JP20060282256 申请日期 2006.10.17
申请人 RENESAS TECHNOLOGY CORP 发明人 MORIGUCHI HIROSHI
分类号 H01L21/677;B25J15/08 主分类号 H01L21/677
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