发明名称 METHOD TO COOL A BAKE PLATE USING AN ACTIVELY CHILLED TRANSFER SHUTTLE
摘要 A method of performing a temperature set point change for a bake plate of a track lithography tool includes positioning a cooling surface of an actively chilled transfer shuttle adjacent a process surface of the bake plate. The actively chilled transfer shuttle includes the cooling surface and a transfer surface opposing the cooling surface. The method also includes monitoring a temperature of the bake plate, initiating a flow of a cooling fluid through one or more orifices provided on the cooling surface of the actively chilled transfer shuttle, and determining that the temperature of the bake plate has decreased by a predetermined temperature. The method further includes terminating the flow of the cooling fluid and moving the actively chilled transfer shuttle to a robot transfer position.
申请公布号 US2008099181(A1) 申请公布日期 2008.05.01
申请号 US20070691461 申请日期 2007.03.26
申请人 SOKUDO CO., LTD. 发明人 RAMANAN NATARAJAN;PINSON JAY D.;CHANG ANZHONG
分类号 H01L21/00 主分类号 H01L21/00
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