| 摘要 |
A package substrate ( 16 ) for electrically connecting an integrated circuit ( 12 ) to a printed circuit board ( 14 ) includes a core ( 222 c), a patterned conductive layer ( 220 c), a plurality of spaced apart, discrete capacitors ( 230 ), and an insulating layer ( 222 b). The patterned conductive layer ( 220 c) is positioned on the core ( 222 c). The discrete capacitors ( 230 ) are electrically connected to the patterned conductive layer ( 220 c). The insulating layer ( 222 b) covers the patterned conductive layer ( 220 c) and separates the capacitors ( 230 ). The capacitors ( 230 ) are positioned to provide a relatively low impedance path for quick access to power to stabilize the voltage delivered to the integrated circuit ( 12 ), and the capacitors ( 230 ) do not occupy valuable space on the integrated circuit ( 12 ), and the printed circuit board ( 14 ). Further, this placement of the capacitor assembly ( 18 ) allows for use of a relatively large number of discrete capacitors ( 230 ) without taking up valuable space from the surface of the package substrate ( 16 ). |
