| 摘要 |
PROBLEM TO BE SOLVED: To obtain a bare chip capable of preventing cracks on a surface protective film caused by assembly stress, and to obtain a tape carrier package and a plasma display panel. SOLUTION: The bare chip has: a substrate; a plurality of pads arranged on the substrate; the surface protective film that is provided while covering the plurality of pads and has an opening exposing the plurality of pads partially; and a plurality of bump electrodes connected to the plurality of pads via the opening each. The periphery of the pad protrudes from that of a corresponding bump electrode. The pad has a groove existing between a side opposite to an adjacent pad and the opening and directly below the corresponding bump electrode. The groove is filled with the surface protective film completely. COPYRIGHT: (C)2008,JPO&INPIT
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