METHOD AND APPARATUS FOR MANUFACTURING CLEANED SUBSTRATES OR CLEAN SUBSTRATES WHICH ARE FURTHER PROCESSED

摘要

Plasma etch-cleaning of substrates is performed by means of a plasma discharge arrangement comprising an electron source cathode ( 5 ) and an anode arrangement ( 7 ). The anode arrangement ( 7 ) comprises on one hand an anode electrode ( 9 ) and on the other hand and electrically isolated therefrom a confinement ( 11 ). The confinement ( 11 ) has an opening ( 13 ) directed towards an area (S) of a substrate ( 21 ) to be cleaned. The electron source cathode ( 5 ) and the anode electrode ( 9 ) are electrically supplied by a supply circuit with a supply source ( 19 ). The circuit is operated electrically floating.