| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which enhances resolution/adhesion by high-speed developability (of an unexposed portion) and excellent developer resistance (of an exposed portion), improves dispersibility in a developer, and suppresses foaming of an etching solution, a photosensitive element using the same, a method for producing a resist pattern and a method for producing a printed wiring board. <P>SOLUTION: The photosensitive resin composition comprises (A) butyl acrylate as a component (polymerizable monomer) of a binder polymer, (B) a polyfunctional methacrylate compound (having two or more reaction sites (unsaturated double bonds)) as an ethylenically unsaturated photopolymerizable monomer, (C) a photopolymerization initiator and (D) a sensitizer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
