发明名称 |
SUBSTRATE PROCESSOR AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To reduce the contamination of a substrate, and simultaneously to quickly cool the substrate. SOLUTION: This substrate processor includes: a substrate holding tool 35 for holding a plurality of substrates 39; a treatment chamber 100 for holding the plurality of substrates 39 by the substrate holding tool 35, and for carrying out heat treatment; a preliminary chamber installed adjacently to the treatment chamber 100; and a heat exchanging part driving mechanism for inserting a heat exchanging part between the plurality of substrates 39 and 39 held by the substrate holding tool 35 in the preliminary chamber. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008103707(A) |
申请公布日期 |
2008.05.01 |
申请号 |
JP20070246692 |
申请日期 |
2007.09.25 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
NISHIDO SHUHEI;YUYA YUKINORI |
分类号 |
H01L21/02;H01L21/677;H01L21/683 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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