发明名称 SUBSTRATE PROCESSOR AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the contamination of a substrate, and simultaneously to quickly cool the substrate. SOLUTION: This substrate processor includes: a substrate holding tool 35 for holding a plurality of substrates 39; a treatment chamber 100 for holding the plurality of substrates 39 by the substrate holding tool 35, and for carrying out heat treatment; a preliminary chamber installed adjacently to the treatment chamber 100; and a heat exchanging part driving mechanism for inserting a heat exchanging part between the plurality of substrates 39 and 39 held by the substrate holding tool 35 in the preliminary chamber. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008103707(A) 申请公布日期 2008.05.01
申请号 JP20070246692 申请日期 2007.09.25
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NISHIDO SHUHEI;YUYA YUKINORI
分类号 H01L21/02;H01L21/677;H01L21/683 主分类号 H01L21/02
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