| 摘要 |
A deposition apparatus includes at least one deposition chamber having a source and a substrate holder, the source being configured to deposit a deposition material on a substrate on the substrate holder, a measurement chamber electrically connected to the deposition chamber, the measurement chamber configured to measure in real time a thickness of the deposition material on the substrate, and at least one layer thickness controller in contact with the deposition chamber, the layer thickness controller being configured to control deposition of the deposition material on the substrate to a predetermined thickness in real time.
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