发明名称 SINGLE-LAYER POLISHING PAD
摘要 A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.
申请公布号 US2008102741(A1) 申请公布日期 2008.05.01
申请号 US20070964046 申请日期 2007.12.26
申请人 发明人 SHIH WEN-CHANG;CHANG YUNG-CHUNG;CHU MIN-KUEI
分类号 B24D11/00 主分类号 B24D11/00
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