发明名称 SELF-REGULATED COOLING MECHANISM
摘要 Regulating the temperature of a heat-generating device within a desired range using shape memory materials disposed on a heat sink. According to one embodiment, cooling fins are placed upon a heat-generating device. Fluid flows through the cooling fins to remove heat from the device. A shape memory material is placed within the path of fluid flow to regulate the amount of fluid flow in response to stimuli at desired low and high operating temperatures of the heat-generating device. At the low desired device operating temperature, the shape memory material restricts the amount of fluid flow through the cooling fins. At the high desired device operating temperature, the shape memory material does not restrict fluid flow through the cooling fins.
申请公布号 US2008099193(A1) 申请公布日期 2008.05.01
申请号 US20060555348 申请日期 2006.11.01
申请人 AKSAMIT SLAVEK PETER;MCLEAN JAMES GORDON;MEDINA CRISTIAN 发明人 AKSAMIT SLAVEK PETER;MCLEAN JAMES GORDON;MEDINA CRISTIAN
分类号 H05K7/20;G05D23/00 主分类号 H05K7/20
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