| 摘要 |
A heat-dissipating assembly structure includes a first heat dissipating sheet attached to one side of a memory module and having first hooks at one long side, a second heat dissipating sheet attached to the opposite side of the memory module and having second hooks at one long side respectively hooked up with the first hooks, and pairs of guide plates respectively provided at the same long side of the left heat dissipating sheet and the same long side of the right heat dissipating sheet at different elevations for guiding the first hooks into engagement with the second hooks during installation of the heat-dissipating assembly structure.
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