| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-stage semiconductor module capable of suppressing generation of warpage, while improving moisture-proof stability, and to provide its manufacturing method. <P>SOLUTION: The semiconductor module 1 is constituted by alternately laminating resin substrates and sheet members 5; the resin substrate has a first embedded conductor 7, and a semiconductor chip 2 mounted on the upper surface thereof; and the sheet member 5 has an opening 10 for storing a semiconductor chip 2, and a second embedded conductor 9 electrically connected to the first embedded conductor 7. Furthermore, the semiconductor module 1 has a plurality of the resin substrates and the sheet members 5, and the first resin substrate 4, disposed at the lowest stage of all the resin substrates, is thicker than the other second substrates 3. The sheet members 5 have adhesive members that cover the upper and side faces of the semiconductor chip 2. <P>COPYRIGHT: (C)2008,JPO&INPIT |
