| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser cutting method which is suitably used for surely cutting a substrate to be machined with a cutting size as short as several millimeters, while minimizing the damage of the substrate. <P>SOLUTION: Laser beams generated by a laser oscillator 5 are reflected toward the side of the substrate 1a to be machined by a total reflection mirror 6 and made to converge by a cylindrical lens 7. The position of a laser irradiation region LB is set/fixed at/to the end of a groove 2 formed in the surface of the substrate 1a by an image processing apparatus 4 and irradiated. A generated crack is developed along the groove 2, and cutting in the short side direction of the substrate 1a is completed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
