| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wired circuit substrate with a simple structure, which reduces transmission loss, sufficiently secures adhesion between a metal support substrate and a metal foil, and also secures a long-term excellent reliability. SOLUTION: Two metal support substrates 2 are prepared, the metal thin film 3 is formed on the substrate 2, the foil 4 is formed on the film 3, a base insulating layer 5 is formed on the foil 4 and the substrate 2, a conductor pattern 6 is formed on the layer 5 as a wired circuit pattern, and an opening 9 is formed by etching in a portion opposed to the foil 4 in the substrate 2. COPYRIGHT: (C)2008,JPO&INPIT
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