发明名称 |
METHODS AND APPARATUSES FOR IMPROVED STABILIZATION IN A PROBING SYSTEM |
摘要 |
Improved methods and apparatuses for automatically and accurately maintaining the alignment of a wafer prober to the bonding pads of a semiconductor device in the presence of motion disturbances are provided. In one embodiment of one aspect of the invention, a feedback control system incorporating information from a number of acceleration and/or velocity sensors is used to maintain the desired contact position in the presence of motion disturbances. Other aspects and other embodiments are also described.
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申请公布号 |
US2008100321(A1) |
申请公布日期 |
2008.05.01 |
申请号 |
US20070874837 |
申请日期 |
2007.10.18 |
申请人 |
NAYAK UDAY;CASLER RICHARD J JR;JEDDA MAX |
发明人 |
NAYAK UDAY;CASLER RICHARD J.JR.;JEDDA MAX |
分类号 |
G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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