| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition curable by condensation reaction, excellent in transparency and heat resistance, and also in thermal stability, hardness(curability) and adhesiveness to substrate, thus suitable to light-emitting diode element-processing applications including transparent sealing materials and adhesives. <P>SOLUTION: The resin composition comprises an acrylic resin, a condensation-reactive silicone compound and/or a condensation-reactive silane compound and a curing promoter, wherein the total amount of the condensation-reactive silicone compound and the condensation-reactive silane compound is 250-2,000 pts.wt. based on 100 pts.wt. of the acrylic resin. <P>COPYRIGHT: (C)2008,JPO&INPIT |
