| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sheet for die sorting capable of storing and conveying even a chip having an adhesive layer with a tack at a rear surface in a stable state, and also to provide a method which stores and conveys the chip having the adhesive layer by the sheet for the die sorting in a stable state. <P>SOLUTION: The sheet 10 for the die sorting allows a gluing agent layer 11 to be exposed at the outer circumference 13 of a carrier sheet, and the conveyance method of the chip 80 with an adhesive layer 61 which is formed by exposing a base film 12 at a center 14 being the inside the outer circumference part 13 comprises steps of preparing the sheet 10 for the die sorting fixed by a frame body through the gluing agent layer 11 of the outer circumference 13, tacking the adhesive layer 61 of the picked up chip 80 to the base film 12 exposed in the sheet 10 for the die sorting, and conveying the sheet 10 for the die sorting to which the chip 80 is tacked through the adhesive layer 61 to a subsequent process. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
