发明名称 ANTISTATIC RESIN MOLDING, AND SECONDARY MOLDING THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an antistatic resin molding in which both antistatic property and transparency are substantially improved rather than not deteriorated by hot-molding (secondary molding), and to provide a secondary molding formed by further hot-molding. SOLUTION: The molding comprises a transparent antistatic layer of thermoplastic resin having thickness of 0.15-3.5μm in which entangling ultrafine long carbon fibers 2-15 wt.% with a wire diameter 100 nm or less and an aspect ratio not less than 5 is contained in a surface of a transparent base material of the thermoplastic resin. Surface resistivity of the antistatic layer after hot-molding at molding magnification of 3 becomes not more than the surface resistivity of the antistatic layer before hot-molding. Total light transmittance is more than 60% when hot-molded further at the molding magnification of 1.1-10, and the haze is not more than 20%, and the surface resistivity of the antistatic layer is less than 10<SP>12</SP>Ω/SQUARE. The secondary molding is formed by further hot-molding the antistatic resin molding at the molding magnification of 1.1-10. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008103354(A) 申请公布日期 2008.05.01
申请号 JP20070335571 申请日期 2007.12.27
申请人 TAKIRON CO LTD 发明人 SAKAI MASAHITO;TAKAHASHI HIROSHI;ITO HIDEMI;NAGAMINE TOSHIJI
分类号 H01B5/14;B29C51/14;B29K105/32;B29L9/00 主分类号 H01B5/14
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