发明名称 APPARATUS FOR DELIVERING SHIELDING GAS DURING WIRE BONDING
摘要 An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main body from a side of the main body generally in a first direction and the slot also extends from a top surface to a bottom surface of the main body in a second direction perpendicular to the first direction for the width of the slot. The slot is sized to receive a tip of the capillary which is operable to pass through the slot in the second direction. A gas outlet, which may be formed inside the slot, supplies shielding gas into the slot.
申请公布号 US2008099531(A1) 申请公布日期 2008.05.01
申请号 US20060554108 申请日期 2006.10.30
申请人 WONG YAM MO;KWAN KA SHING KENNY 发明人 WONG YAM MO;KWAN KA SHING KENNY
分类号 B23K1/00;B23K37/00 主分类号 B23K1/00
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