Conductive Particles Comprising Complex Metal Layer With Density Gradient, Method for Preparing the Particles, and Anisotropic Conductive Adhesive Composition Comprising the Particles

摘要

Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).