| 摘要 |
<P>PROBLEM TO BE SOLVED: To inexpensively manufacture an IC tag inlet without irregularities. <P>SOLUTION: After an antenna 12 is printed on a substrate 11 of low density paper, an IC chip 13 is mounted on the antenna 12 via the application of bond 14 and the IC chip 13 is embedded into the substrate 11 under pressure to prevent irregularities in the surface of the substrate 11 due to the thickness of the IC chip 13. <P>COPYRIGHT: (C)2008,JPO&INPIT |
