SEMICONDUCTOR DEVICE AND METHOD FOR FORMING IT

摘要

PROBLEM TO BE SOLVED: To provide a method for forming wiring which is electrically connected to a lower region through a contact. SOLUTION: The method for forming the wiring includes steps of: forming an insulating film on a substrate which has a plurality of first regions and a plurality of second regions which are arranged between the first regions; forming a plurality of first wiring on the insulating film which are connected electrically to the corresponding first regions through first contacts penetrating the insulating film; forming spacers on side faces of the first wiring; removing the insulating film positioned between the adjacent spacers so as to form a plurality of contact holes in which the corresponding second regions are exposed between the adjacent first contacts; and forming a plurality of second contacts which are filled in the corresponding contact holes to form a plurality of second wiring which are connected electrically to the corresponding second contacts. COPYRIGHT: (C)2008,JPO&INPIT