摘要 |
The electroconductive resin composition comprising 1 to 30 mass % of carbon fiber having a hollow structure, an average filament diameter of 50 to 500 nm and an average aspect ratio of 50 to 1000 and 99 to 70 mass % of resin, wherein the volume ratio of carbon fiber agglomerate to one carbon fiber filament constituting the agglomerate in the resin composition (volume of carbon fiber agglomerate/volume of a carbon fiber filament) is 1500 or less according to the invention can be uniformly dispersed in resin without agglomeration and therefore, a good electroconductivity can be achieved by addition of small amount of the composition.
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