发明名称 Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
摘要 A light emitting device (LED) assembly may include an electrically insulating substrate and a thermally conductive layer on a surface of the insulating substrate. A light emitting device may be on the thermally conductive layer so that the thermally conductive layer is between the light emitting device and the electrically insulating substrate. Moreover, the thermally conductive layer may extend beyond an edge of the light emitting device in at least one direction a distance greater than half of a width of the light emitting device.
申请公布号 US2008099770(A1) 申请公布日期 2008.05.01
申请号 US20060590480 申请日期 2006.10.31
申请人 MEDENDORP NICHOLAS W;ANDREWS PETER 发明人 MENDENDORP NICHOLAS W.;ANDREWS PETER
分类号 H01L33/62;H01L33/64 主分类号 H01L33/62
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