| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit module capable of reducing the amount of loss produced by the incorporation of a defective chip component and reducing malfunction caused by failure in joining, and to provide its manufacturing method. <P>SOLUTION: The circuit module 1 of the invention comprises a multilayer wiring board 2 having a first cavity 2a and an interposer 4 on which a chip component 3 is mounted. The interposer 4 is joined to the multilayer wiring board 2 so that the chip component 3 is arranged in the first cavity 2a and the first cavity 2a is sealed with the interposer. When the circuit module 1 is manufactured, inspection voltage is supplied to the interposer 4 and the conduction of the chip component 3 is previously inspected before the interposer 4 and the multilayer wiring board 2 are joined to each other. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
