| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of downsizing without semiconductor element chip size reduction. <P>SOLUTION: An external electrode 3b connected to a terminal 2b of the semiconductor element 2 having an approximate rectangular shape by a wire 5 is provided at a corner of the semiconductor device 1 having an approximate rectangular shape. The semiconductor element 2 is arranged at a tilt so that the angle between the side 1a of the semiconductor device 1 and the side 2a of the semiconductor element 2 is 45°. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
