发明名称 PACKAGE FOR PRESSURE SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a package for a pressure sensor, sufficiently thin in an extent usable even in application used installed in a micro area. SOLUTION: This package 1 is constituted mainly of the pressure sensor 11 joined with the first substrate 11a having a fixed electrode, and the second substrate 11b having a movable electrode arranged with the prescribed space with respect to the fixed electrode, a support substrate 12 having an opening part 12a capable of storing the second substrate 11b, and a resin layer 13 for fixing the pressure sensor 11 and the support substrate 12. The pressure sensor 11 is mounted on the support substrate 12 via the first substrate 11a and a joining member 14, under the condition where the second substrate 11b is engaged with the opening part 12a. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008101918(A) 申请公布日期 2008.05.01
申请号 JP20060282128 申请日期 2006.10.17
申请人 ALPS ELECTRIC CO LTD 发明人 FUKUDA TETSUYA;SATO KIYOSHI;KIKUIRI KATSUYA;WATABE MITSURU
分类号 G01L9/00 主分类号 G01L9/00
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