发明名称 SEMICONDUCTOR DEVICES WITH DUAL-METAL GATE STRUCTURES AND FABRICATION METHODS THEREOF
摘要 Semiconductor devices with dual-metal gate structures and fabrication methods thereof. A semiconductor substrate with a first doped region and a second doped region separated by an insulation layer is provided. A first metal gate stack is formed on the first doped region, and a second metal gate stack is formed on the second doped region. A sealing layer is disposed on sidewalls of the first gate stack and the second gate stack. The first metal gate stack comprises an interfacial layer, a high-k dielectric layer on the interfacial layer, a first metal layer on the high-k dielectric layer, a metal insertion layer on the first metal layer, a second metal layer on the metal insertion layer, and a polysilicon layer on the second metal layer. The second metal gate stack comprises an interfacial layer, a high-k dielectric layer on the interfacial layer, a second metal layer on the high-k dielectric layer, and a polysilicon layer on the second metal layer.
申请公布号 US2008099851(A1) 申请公布日期 2008.05.01
申请号 US20060552704 申请日期 2006.10.25
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 HSU PENG-FU;YEN FONG-YU;MOR YI-SHIEN;LIN HUAN-JUST;JIN YING;TAO HUN-JAN
分类号 H01L29/94;H01L21/8238 主分类号 H01L29/94
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