| 发明名称 |
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR APPARATUS |
| 摘要 |
Provided is a semiconductor package manufacturing method. The method comprises forming a metal circuit pattern on a substrate; connecting an integrated circuit unit to the metal circuit pattern; forming a resin on the substrate, the metal circuit pattern and the integrated circuit unit; and removing the substrate.
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| 申请公布号 |
US2008099927(A1) |
申请公布日期 |
2008.05.01 |
| 申请号 |
US20070931516 |
申请日期 |
2007.10.31 |
| 申请人 |
INTEGRANT TECHNOLOGIES INC. |
发明人 |
TCHUN SEOK PHYO;KIM KYUNG OH |
| 分类号 |
H01L23/50;H01L21/56 |
主分类号 |
H01L23/50 |
| 代理机构 |
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