| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma etching machining method capable of machining a substrate continuously and precisely by using a plasma etching device for performing the dry etching of the substrate, and to provide a method of manufacturing a liquid injection head using the plasma etching machining method. <P>SOLUTION: There are provided: a process for forming a protective film 201 having an opening of prescribed dimensions on the substrate; and an etching process for performing dry etching to the substrate by the plasma etching device with the protective film 201 as a mask. A Vpp value of an electrode in the plasma etching device is measured under the etching process, and a setting Vpp value set in each etching process is adjusted based on a measurement Vpp value measured in a previous etching process. <P>COPYRIGHT: (C)2008,JPO&INPIT |
