| 摘要 |
PROBLEM TO BE SOLVED: To provide a modified polyimide resin composition, a paste made of the composition and an electronic device having a solder resist layer, a surface-protection layer, an interlayer insulation layer or an adhesive layer obtained from the composition. SOLUTION: The modified polyimide resin comprises: component (A) a modified polyimide resin obtained by using (a) a trivalent and/or tetravalent polycarboxylic acid derivative having an acid anhydride group, (b) a polyol expressed by general formula (1) and (c) an alicyclic polyamine residue derivative as essential components and reacting the components in an organic solvent selected from an ether solvent, an ester solvent, a ketone solvent and an aromatic hydrocarbon solvent; and component (B) an epoxy resin having≥2 epoxy groups in one molecule, and is produced without using a solvent substitution treatment after the reaction and is essentially free from organic solvents except for the above solvents. The invention further provides a paste composed of the resin composition and an electronic device produced by using the same. COPYRIGHT: (C)2008,JPO&INPIT
|
